Archival Journal Papers
Intrinsic Stress Generation and Relaxation of Plasma-Enhanced Chemical Vapor Deposited Oxide During Deposition and Subsequent Thermal Cycling,
K-S Chen, X. Zhang, and S-Y Lin,
Thin Solid Films, 2003, 434(1-2): 190-202. [DOI;
PDF]
Enhancement of Rotordynamic Performance of High-Speed Micro-Rotors for Power MEMS Applications by Precision Deep Reactive Ion Etching,
N. Miki, C.J. Teo, L. Ho, and X. Zhang,
Sensors and Actuators A: Physical, 2003, 104(3): 263-267. [DOI;
PDF]
Thermo-Mechanical Behavior of Thick PECVD Oxide Films for Power MEMS Applications,
X. Zhang, K-S Chen, and S.M. Spearing,
Sensors and Actuators A: Physical, 2003, 103(1-2): 263-270. [DOI;
PDF]
Multi-Stack Silicon-Direct Wafer Bonding for 3D MEMS Manufacturing,
N. Miki, X. Zhang, R. Khanna, A.A. Ayon, D. Ward, and S.M. Spearing,
Sensors and Actuators A: Physical, 2003, 103(1-2): 194-201. [DOI;
PDF]
Characterization of Silicon Wafer Bonding for Power MEMS Applications,
A.A. Ayon, X. Zhang, K. Turner, D. Choi, B. Miller, S.F. Nagle, and S.M. Spearing,
Sensors and Actuators A: Physical, 2003, 103(1-2): 1-8. [DOI;
PDF]
Effect of Process Parameters on the Surface Morphology and Mechanical Performance of Silicon Structures after Deep Reactive Ion Etching (DRIE),
K-S Chen, A.A. Ayon, X. Zhang, and S.M. Spearing,
Journal of Microelectromechanical Systems, 2002, 11(3): 264-275. [DOI;
PDF]
Anisotropic Silicon Trenches 300-500 um Deep Employing Time Multiplexed Deep Etching (TMDE),
A.A. Ayon, X. Zhang, and R. Khanna,
Sensors and Actuators A: Physical, 2001, 91(3): 381-385. [DOI;
PDF]
Residual Stress and Fracture in Thick Tetraethylorthosilicate (TEOS) and Silane-Based PECVD Oxide Films,
X. Zhang, K-S Chen, R. Ghodssi, A.A. Ayon, and S.M. Spearing,
Sensors and Actuators A: Physical, 2001, 91(3): 373-380. [DOI;
PDF]
Conference Proceeding Papers
Precision Fabrication of High-Speed Micro-Rotors Using Deep Reactive Ion Etching (DRIE),
N. Miki, C.J. Teo, L. Ho, and X. Zhang,
Technical Digest of IEEE Solid-State Sensor and Actuator Workshop (Hilton Head '02),
Hilton Head Island, SC, USA, June 2-6, 2002, pp. 265-268.
A Study of Multi-Stack Silicon-Direct Wafer Bonding for MEMS Manufacturing,
N. Miki, X. Zhang, R. Khanna, A.A. Ayon, D. Ward, and S.M. Spearing,
Proceeding of the 15th IEEE International Conference on Micro Electro Mechanical Systems (MEMS '02),
Las Vegas, NV, USA, January 20-24, 2002, pp. 407-410.
Residual Stress and Fracture of Thick Dielectric Films for Power MEMS Applications,
X. Zhang, K-S Chen, and S.M. Spearing,
Proceeding of the 15th IEEE International Conference on Micro Electro Mechanical Systems (MEMS '02),
Las Vegas, NV, USA, January 20-24, 2002, pp. 164-167.
Low Temperature Silicon Wafer Bonding for MEMS Applications,
A.A. Ayon, X. Zhang, K. Turner, D. Choi, B. Miller, S.F. Nagle, and S.M. Spearing,
Proceeding of the 15th IEEE International Conference on Micro Electro Mechanical Systems (MEMS '02),
Las Vegas, NV, USA, January 20-24, 2002, pp. 411-414.
Residual Stress Characterization of Thick PECVD TEOS Film for Power MEMS Applications,
X. Zhang, R. Ghodssi, K-S Chen, A.A. Ayon, and S.M. Spearing,
Technical Digest of IEEE Solid-State Sensor and Actuator Workshop (Hilton Head '00),
Hilton Head Island, SC, USA, June 4-8, 2000, pp. 316-319.
Ultra Deep Anisotropic Silicon Trenches Using Deep Reactive Ion Etching (DRIE),
A.A. Ayon, X. Zhang, and R. Khanna,
Technical Digest of IEEE Solid-State Sensor and Actuator Workshop (Hilton Head '00),
Hilton Head Island, SC, USA, June 4-8, 2000, pp. 339-342.
