Archival Journal Papers
Measurement of Fracture Mechanical Properties of Silicon Oxynitride Films after Rapid Thermal Annealing,
I-K Lin, P-H Wu, K-S Ou, K-S Chen, and X. Zhang,
submitted for publication.
Effects of Composition and Annealing Temperature on the Mechanical Properties and Residual Stress of Silicon Oxycarbide Films,
P. Du, X. Wang, I-K Lin, and X. Zhang,
Sensors and Actuators A: Physical, 2012, 176: 90-98. [DOI;
PDF]
Mechanical Property Characterization of Sputtered and Plasma Enhanced Chemical Deposition (PECVD) Silicon Nitride Films after Rapid Thermal Annealing,
P-H Wu, I-K Lin, H-Y Yan, K-S Ou, K-S Chen, and X. Zhang,
Sensors and Actuators A: Physical, 2011, 168(1): 117-126. [DOI;
PDF]
Mechanical Properties of Sputtered Silicon Oxynitride Films by Nanoindentation,
Y. Liu, I-K Lin, and X. Zhang,
Materials Science and Engineering A, 2008, 489(1-2): 294-301. [DOI;
PDF]
Nanoindentation Stress-Strain Curves of Plasma-Enhanced Chemical Vapor Deposited Silicon Oxide Thin Films,
Z. Cao and X. Zhang,
Thin Solid Films, 2008, 516(8): 1941-1951. [DOI;
PDF]
Nanoindentation Creep of Plasma-Enhanced Chemical Vapor Deposited Silicon Oxide Thin Films,
Z. Cao and X. Zhang,
Scripta Materialia, 2007, 56(3): 249-252. [DOI;
PDF]
Size-dependent Creep Behavior of Plasma-Enhanced Chemical Vapor Deposited Silicon Oxide Films,
Z. Cao and X. Zhang,
Journal of Physics D: Applied Physics, 2006, 39(23): 5054-5063. [DOI;
PDF]
Experiments and Theory of Thermally-Induced Stress Relaxation in Amorphous Dielectric Films for MEMS and IC Applications,
Z. Cao and X. Zhang,
Sensors and Actuators A: Physical, 2006, 127(2): 221-227. [DOI;
PDF]
Microbridge Testing of Plasma-Enhanced Chemical-Vapor Deposited Silicon Oxide Films on Silicon Wafers,
Z. Cao, T-Y Zhang, and X. Zhang,
Journal of Applied Physics, 2005, 97(10): 104909(9pp). [DOI;
PDF]
Density Change and Viscous Flow During Structural Relaxation of Plasma-Enhanced Chemical-Vapor-Deposited Silicon Oxide Films,
Z. Cao and X. Zhang,
Journal of Applied Physics, 2004, 96(8): 4273-4279. [DOI;
PDF]
