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MicroEngine: Fabrication and Characterization

Representative Publications (#denotes graduate students/postdocs supervised by X. Zhang; *denotes corresponding author by X. Zhang; +denotes contributed equally.)

K-S Chen, X. Zhang, S-Y Lin, "Intrinsic Stress Generation and Relaxation of Plasma-Enhanced Chemical Vapor Deposited Oxide During Deposition and Subsequent Thermal Cycling," Thin Solid Films, 2003, 434(1-2): 190-202. [DOI]

N. Miki, C.J. Teo, L. Ho, X. Zhang, "Enhancement of Rotordynamic Performance of High-Speed Micro-Rotors for Power MEMS Applications by Precision Deep Reactive Ion Etching," Sensors and Actuators A: Physical, 2003, 104(3): 263-267. [DOI]

X. Zhang, K-S Chen, S.M. Spearing, "Thermo-Mechanical Behavior of Thick PECVD Oxide Films for Power MEMS Applications," Sensors and Actuators A: Physical, 2003, 103(1-2): 263-270. [DOI]

N. Miki, X. Zhang, R. Khanna, A.A. Ayon, D. Ward, S.M. Spearing, "Multi-Stack Silicon-Direct Wafer Bonding for 3D MEMS Manufacturing," Sensors and Actuators A: Physical, 2003, 103(1-2): 194-201. [DOI]

A.A. Ayon, X. Zhang, K. Turner, D. Choi, B. Miller, S.F. Nagle, S.M. Spearing, "Characterization of Silicon Wafer Bonding for Power MEMS Applications," Sensors and Actuators A: Physical, 2003, 103(1-2): 1-8. [DOI]

K-S Chen, A.A. Ayon, X. Zhang, S.M. Spearing, "Effect of Process Parameters on the Surface Morphology and Mechanical Performance of Silicon Structures after Deep Reactive Ion Etching (DRIE)," Journal of Microelectromechanical Systems, 2002, 11(3): 264-275. [DOI]

X. Zhang, K-S Chen, R. Ghodssi, A.A. Ayon, S.M. Spearing, "Residual Stress and Fracture in Thick Tetraethylorthosilicate (TEOS) and Silane-Based PECVD Oxide Films," Sensors and Actuators A: Physical, 2001, 91(3): 373-380. [DOI]

A.A. Ayon, X. Zhang, R. Khanna, "Anisotropic Silicon Trenches 300-500 um Deep Employing Time Multiplexed Deep Etching (TMDE)," Sensors and Actuators A: Physical, 2001, 91(3): 381-385. [DOI]

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