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Mechanical Behavior of Power MEMS Thin Films

Recent Power MEMS are pushing electrical and mechanical power requirements to higher levels. Higher power applications require advances in the field of structures and materials. Our area of research is on the advanced materials and mechanics for Power MEMS applications. A major area of emphasis is the characterization and testing of Power MEMS materials. Research is being pursued to obtain a thorough understanding of the mechanical properties and engineering physics of long-term reliability of materials used in Power MEMS. Research is also being undertaken to develop new materials that extend the capabilities of Power MEMS.

Representative Publications (#denotes graduate students/postdocs supervised by X. Zhang; *denotes corresponding author by X. Zhang; +denotes contributed equally.)

J. Dong#, P. Du#, X. Zhang*, "Characterization of the Young's Modulus and Residual Stresses for a Sputtered Silicon Oxynitride Film Using Micro-Structures," Thin Solid Films, 2013, 545: 414-418. [DOI]

P. Du#, X. Wang#, I-K Lin#, X. Zhang*, "Effects of Composition and Thermal Annealing on the Mechanical Properties of Silicon Oxycarbide Films," Sensors and Actuators A: Physical, 2012, 176: 90-98. [DOI]

P-H Wu, I-K Lin#, H-Y Yan, K-S Ou, K-S Chen, X. Zhang*, "Mechanical Property Characterization of Sputtered and Plasma Enhanced Chemical Deposition (PECVD) Silicon Nitride Films after Rapid Thermal Annealing," Sensors and Actuators A: Physical, 2011, 168(1): 117-126. [DOI]

Y. Liu#, I-K Lin#, X. Zhang*, "Mechanical Properties of Sputtered Silicon Oxynitride Films by Nanoindentation," Materials Science and Engineering A, 2008, 489(1-2): 294-301. [DOI]

Z. Cao# and X. Zhang*, "Nanoindentation Stress-Strain Curves of Plasma-Enhanced Chemical Vapor Deposited Silicon Oxide Thin Films," Thin Solid Films, 2008, 516(8): 1941-1951. [DOI]

Z. Cao# and X. Zhang*, "Nanoindentation Creep of Plasma-Enhanced Chemical Vapor Deposited Silicon Oxide Thin Films," Scripta Materialia, 2007, 56(3): 249-252. [DOI]

Z. Cao# and X. Zhang*, "Size-Dependent Creep Behavior of Plasma-Enhanced Chemical Vapor Deposited Silicon Oxide Films," Journal of Physics D: Applied Physics, 2006, 39(23): 5054-5063. [DOI]

Z. Cao# and X. Zhang*, "Experiments and Theory of Thermally-Induced Stress Relaxation in Amorphous Dielectric Films for MEMS and IC Applications," Sensors and Actuators A: Physical, 2006, 127(2): 221-227. [DOI]

Z. Cao#, T-Y Zhang, X. Zhang*, "Microbridge Testing of Plasma-Enhanced Chemical-Vapor Deposited Silicon Oxide Films on Silicon Wafers," Journal of Applied Physics, 2005, 97(10): 104909(9pp). [DOI]

Z. Cao# and X. Zhang*, "Density Change and Viscous Flow During Structural Relaxation of Plasma-Enhanced Chemical-Vapor-Deposited Silicon Oxide Films," Journal of Applied Physics, 2004, 96(8): 4273-4280. [DOI]

Ph.D. Dissertation

Zhiqiang Cao, "Mechanical Behaviors of PECVD Dielectric Films for MEMS Applications," Ph.D. Dissertation, Boston University. (Advisor: Xin Zhang; January 2007)

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