Spatial Light Modulators (Segmented Deformable Mirrors)

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A new class of spatial light modulator based on integration of CMOS electronics and surface micromachined piston mirrors has been devloped at Boston University, supported by DARPA through the Coherent Communications, Imaging, and Targeting (CCIT) program. The micromachined spatial light modulator (µSLM) consists of an array of MEMS mirror segments fabricated in aluminum or silicon over a 10 mm square aperture. Each pixel is capable of altering the phase of reflected light by up to one wavelength for visible light. Aluminum µSLMs are integrated directly on CMOS driver electronics, while silicon µSLMs are connected by through-wafer vias (or wire-bonds) to driver electronics

Recent Publications

Lee, H., Miller, M. H., and Bifano, T. G., "CMOS chip planarization by chemical mechanical polishing for a vertically stacked metal MEMS integration." J. Micromech. Microeng., [14] 1, pp. 108-115, 2004


Dimas, C. E., Bifano, T. G., Bierden, P. A., Perreault, J. A., Krulevitch, P. A. Roehnelt, R. T., and Cornelissen, S. A., "Polysilicon surface-micromachined spatial light modulator with novel electronic integration," Proc. SPIE Vol. 4755, p. 477-484, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; Bernard Courtois, Jean Michel Karam, Karen W. Markus, Bernd Michel, Tamal Mukherjee, James A. Walker; Eds., Apr 2002

 

 

Thomas Bifano, College of Engineering, Boston University, 8 St. Mary's St., Boston, MA 02215, (617) 353-8908, tgb@bu.edu